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TYWE3SE Reset & Teardown (FCC ID 2ANDL-TYWE3SE)

Factory reset and internal photos for Tuya Global TYWE3SE. Tuya / Smart Life smart plug.

January 15, 2026 1 min read

TYWE3SE internal photo

Before you buy the Tuya Global TYWE3SE, check what's inside.

The TYWE3SE is a versatile, low-power embedded module by Tuya, integrating both 2.4 GHz Wi-Fi and Bluetooth 4.2 connectivity. It is designed for integration into smart home devices, offering a flexible platform for custom IoT product development.

⚠️ NOTE: Ensure the module is powered within the specified 3.0V to 3.6V range. Handle with ESD precautions.

Quick Specs

  • Manufacturer: Tuya Global
  • Model: TYWE3SE
  • Protocol: WiFi
  • Chipset: ESP8266
  • Ecosystem: Tuya / Smart Life
  • App: Smart Life

🔧 Geek Corner (Flashing Info)

  • Chipset: ESP32
  • Flashable: ✅ Yes
  • Info: The ESP32 chipset is well-supported for flashing custom firmware like ESPHome or Tasmota.

User Manual

Scanned pages from the official user manual:

TYWE3SE Manual

TYWE3SE Manual

TYWE3SE Manual

TYWE3SE Manual

TYWE3SE Manual

TYWE3SE Manual

TYWE3SE Manual

TYWE3SE Manual

TYWE3SE Manual

TYWE3SE Manual

External Photos

Photos of the device exterior:

TYWE3SE Exterior

Internal Photos

Teardown photos showing the PCB and components:

TYWE3SE PCB

Verdict

The TYWE3SE is a WiFi device from the Tuya / Smart Life ecosystem.

📄 Click to view full text manual (SEO)
TYWE3SE Datasheet
1
1. Product Overview
TYWE3SE is a low-power embedded 2.4 GHz Wi-Fi and Bluetooth module that Tuya has 
developed. It consists of a highly integrated RF chip (ESP32) and several peripheral 
components, with an embedded Wi-Fi network protocol stack and robust library functions. 
TYWE3SE is embedded with a low-power 32-bit CPU, 4 MB flash memory, 448 KB read 
only memory (ROM), and 520 KB static random-access memory (SRAM), and has 
extensive peripherals. TYWE3SE is an RTOS platform that integrates all function libraries 
of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi and Bluetooth 
products as required.
1.1 Features
Embedded low-power 32-bit CPU, which can also function as an application 
processor
Dominant frequency: 160 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: 14 GPIOs, 1 universal asynchronous receiver/transmitter (UART), and 1 
analog-to-digital converter (ADC)
Wi-Fi connectivity
802.11b/g/n
2.4 GHz Wi-fi
WPA and WPA2 security modes
Tuya TYWE3SE Wi-Fi and Bluetooth 
Module
Version: 1.0.1 Date: 2019-07-23 No.: 0000000001
Product 
Manual
Global Intelligent Platform
TYWE3SE Datasheet
2
Up to +20 dBm output power in 802.11b mode
Smart and AP network configuration modes for Android and iOS devices
Onboard PCB antenna with a gain of 2.5 dBi
Working temperature: –20°C to +85°C
Bluetooth connectivity
Complete Bluetooth 4.2 standards: Bluetooth Basic Rate/Enhanced Data Rate 
(BR/EDR) and Bluetooth Low Energy (BLE)
Class 1, Class 2, and Class 3 standards, requiring no external power amplifiers
Up to +9 dBm output power
Zero-IF receiver: –92 dBm BLE RX sensitivity
Adaptive frequency hopping (AFH)
Connections with multiple traditional Bluetooth and BLE devices
Simultaneous broadcasting and scanning
1.2 Applications
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
Intelligent bus
TYWE3SE Datasheet
3
Change History
No. Date Change Description Version After Change
1 2019-06-25 This is the first release. 1.0.0
2 2019-07-23 Added GPIO information. 1.0.1
TYWE3SE Datasheet
4
Contents
1. Product Overview ...........................................................................................................1
1.1 Features ................................................................................................................1
1.2 Applications ...........................................................................................................2
Tables .................................................................................................................................6
Figures................................................................................................................................6
2. Module Interfaces ...........................................................................................................7
2.1 Dimensions and Footprint.................................................