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E1P Reset & Teardown (FCC ID 2ANDL-T5-E1P)

Factory reset and internal photos for Tuya Global E1P. Tuya / Smart Life smart plug.

January 16, 2026 1 min read

E1P internal photo

Before you buy the Tuya Global E1P, check what's inside.

The Tuya E1P (FCC ID 2ANDL-T5-E1P) is a module designed for smart devices, featuring both Wi-Fi and Bluetooth connectivity. It is typically integrated into battery-powered end products rather than directly connected to mains power.

⚠️ NOTE: This is a module specification. Ensure proper power handling and isolation when integrating into a final product. If part of a mains-connected device, disconnect mains power before servicing.

Quick Specs

  • Manufacturer: Tuya Global
  • Model: E1P
  • Protocol: WiFi
  • Chipset: Realtek/Beken
  • Ecosystem: Tuya / Smart Life
  • App: Smart Life

🔧 Geek Corner (Flashing Info)

  • Chipset: Realtek/Beken (Specific model TBD)
  • Flashable: ❌ No
  • Info: Modules using Realtek or Beken chipsets often have locked bootloaders or proprietary firmware that prevents easy flashing of alternative firmware like Tasmota.

User Manual

Scanned pages from the official user manual:

E1P Manual

E1P Manual

E1P Manual

E1P Manual

E1P Manual

E1P Manual

E1P Manual

E1P Manual

E1P Manual

E1P Manual

Verdict

The E1P is a WiFi device from the Tuya / Smart Life ecosystem.

📄 Click to view full text manual (SEO)
T5-E1-IPEX Module Datasheet
Version: 20241011
Online Version
Contents
Contents
1. Features ............................................................................. 2
1.1. CPU and on-chip memory .............................................................. 2
1.2. Wi-Fi ............................................................................................... 2
1.3. Bluetooth ....................................................................................... 2
1.4. Peripherals ..................................................................................... 2
1.5. Antenna type ................................................................................. 3
1.6. Operating conditions ...................................................................... 3
1.7. Module certification ....................................................................... 3
1.8. Reliability test ................................................................................ 3
2. Scope of applications .......................................................... 5
3. Pin definition ...................................................................... 6
3.1. Pin layout ....................................................................................... 6
3.2. Pin definition .................................................................................. 7
4. Electrical parameters ........................................................ 18
4.1. Absolute electrical parameters .................................................... 18
4.2. Normal operating conditions ........................................................ 18
4.3. Radio frequency (RF) power ......................................................... 19
4.4. Operating current ........................................................................ 19
5. RF parameters .................................................................. 22
5.1. Basic RF features ......................................................................... 22
5.2. Wi-Fi transmitter (TX) performance .............................................. 22
5.3. Wi-Fi receiver (RX) performance .................................................. 23
5.4. Bluetooth TX performance ........................................................... 24
5.5. Bluetooth RX performance ........................................................... 25
6. Antenna information ......................................................... 26
6.1. Antenna type ............................................................................... 26
6.2. Antenna interference reduction ................................................... 26
7. Development guide ........................................................... 27
7.1. MCU integration ........................................................................... 27
8. Packing and production instructions .................................. 28
8.1. Mechanical dimensions .................................................