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TYZS3 Reset & Teardown (FCC ID 2ANDL-TYZS3)

Factory reset and internal photos for Tuya Global TYZS3. Tuya / Smart Life smart plug.

January 15, 2026 1 min read

TYZS3 internal photo

Before you buy the Tuya Global TYZS3, check what's inside.

The TYZS3 is a low-power embedded Zigbee module designed by Tuya, featuring an ARM Cortex-M4 processor and supporting the 802.15.4 standard. It is ideal for smart home applications requiring integration into a Zigbee network.

⚠️ NOTE: Ensure correct battery polarity when inserting batteries.

Quick Specs

  • Manufacturer: Tuya Global
  • Model: TYZS3
  • Protocol: Zigbee
  • Chipset: Tuya Zigbee
  • Ecosystem: Tuya / Smart Life
  • App: Smart Life

🔧 Geek Corner (Flashing Info)

  • Chipset: EFR32MG13P732F512GM48
  • Flashable: ❌ No
  • Info: Proprietary Tuya Zigbee module, not designed for flashing custom firmware like Tasmota or ESPHome.

User Manual

Scanned pages from the official user manual:

TYZS3 Manual

TYZS3 Manual

TYZS3 Manual

TYZS3 Manual

TYZS3 Manual

TYZS3 Manual

TYZS3 Manual

TYZS3 Manual

TYZS3 Manual

TYZS3 Manual

External Photos

Photos of the device exterior:

TYZS3 Exterior

TYZS3 Exterior

TYZS3 Exterior

TYZS3 Exterior

Internal Photos

Teardown photos showing the PCB and components:

TYZS3 PCB

TYZS3 PCB

TYZS3 PCB

TYZS3 PCB

Verdict

The TYZS3 is a Zigbee device from the Tuya / Smart Life ecosystem.

📄 Click to view full text manual (SEO)
Tuya Inc. V2.0.0
1 Product Overview
TYZS3 is a low-power embedded Zigbee module that Hangzhou Tuya Inc. has developed.
It consists of a highly integrated wireless radio processor chip
(EFR32MG13P732F512GM48) and several peripheral components, with an embedded
802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions. TYZS3 is
embedded with a low-power 32-bit ARM Cortex-M4 core, 512 KB flash memory, and 64
KB random-access memory (RAM), and has extensive peripherals.
TYZS3 is a FreeRTOS platform that integrates all the function libraries of the Zigbee MAC
and TCP/IP protocols. You can develop built-in Zigbee products as required.
Figure 1-1 shows the TYZS3 architecture.
Figure 1-1 TYZS3 architecture
Tuya TYZS3 Zigbee Module
Datasheet
Version: 2.0.0 Date: 2019-07-26 No.:
Global Intelligent Platform
Tuya Inc. V2.0.0
1.1 Features
 Embedded low-power 32-bit ARM Cortex-M4 processor, which provides digital signal
processor (DSP) instructions and floating-point units (FPUs) and also functions as an
application processor
 Dominant frequency: 40 MHz
 Working voltage: 2.0 V to 3.8 V
 Peripherals: nine GPIOs, one UART, and one ADC
 Zigbee features
 802.15.4 MAC/PHY
 Working channels 11 to 26 at 2.400 GHz to 2.483 GHz; 250 kbit/s air interface
rate
 Embedded DC-DC circuit, maximizing the power efficiency
 Maximum output power: +10 dBm; dynamic output power: > 35 dB
 Runtime power consumption: 63 µA/MHz; current in sleep mode: 3.5 µA
 Proactive network configuration for terminals
 TYZS3: Embedded onboard PCB antenna with 2.2 dBi gain.
 TYZS3_IPEX: external high-gain antenna used with the I-PEX connector with 3
dBi gain. Antenna manufacturer: Dongguan UB Electronic CO.,LTD;Antenna
model: UB01C55F3D814A
 Working temperature: –20°C to +85°C
 AES-128/AES-256 hardware encryption
1.2 Applications
 Intelligent building
 Smart household and home appliances
 Intelligent socket and light
 Industrial wireless control
 Health care and measurement
 Asset tracing
Tuya Inc. V2.0.0
Change History
No. Date Change Description Version After Change
1 2018-05-16 This is the first release. 1.0.0
2 2018-05-23 Updated the module silkscreen. 1.0.1
3 2019-01-17 Updated the ADC pin description. 1.0.2
4 2019-02-20 Updated dimensions of the module's
shield cover. 1.0.3
5 2019-04-08 Updated the dimensions tolerance of the
module's shield cover. 1.0.4
6 2019-04-16 Updated the module's working
temperature range. 1.0.5
7 2019-07-23
Updated the dimensions tolerance, and
added the antenna placement reference
figure.
2.0.0
Tuya Inc. V2.0.0
Contents
1 Product Overview.....................................................................................................................1
1.1 Features.........................................................................................................................2
1.2 Applications...................................................................................................................2
2 Module Interfaces................